Compare Switching and Conduction Losses of SiC & GaN vs Traditional Devices

In this webinar, we use the PSIM Thermal Module and SPICE module to compare switching and conduction losses of SiC, GaN, & traditional devices in various operating scenarios.

Agenda:

- definition of a PSIM Thermal SiC or GaN Model

- loss comparison from the Thermal module, SPICE, & datasheet

- design use cases for when to use the thermal module vs a SPICE model