The heat is on! How to Leverage Simulation to Address Thermal Issues

Farhad Behafarid, Director, Electronics Thermal at Altair presents at the 2024 ATCx Electronics conference.

The challenge of managing thermal issues in electronics is nothing new, but modern product design is characterized by increased complexity and faster development cycles. As components require more power and are packed more densely, thermal issues become more critical. However, designers often have less freedom to modify the designs to address these issues in the early stages of the design. Sophisticated yet user-friendly thermal simulation tools could transform development processes. They empower designers and packaging teams to gain greater control over thermal management and reduce lengthy back-and-forth discussions with specialized thermal engineers. This also allows more team members to conduct accurate simulations, detect thermal issues and perform rapid design modifications to mitigate these issues. As a result, teams can quickly explore multiple design iterations and what-if scenarios, leading to faster and more effective identification of optimal and safe solutions