Altair Multiphysics and Simulation for 3D IC Design Optimization

Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and minimizing thermal stress-induced failures as well solder fatigue analysis at early phases of the system design.