Optimizing Chiplets & 3D IC Design with Altair Multiphysics Simulation

Stacking multiple dies, 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and minimizing thermal stress-induced failures.

Presented by Iyad Rayane, Senior Technical Specialist Electronic System Design| Altair, at the ATCx Electronics for Engineers in October 2023, 21.1 mins